Power Amplifiers for the S-, C-, X- and Ku-bands by Mladen Božanić & Saurabh Sinha

Author:Mladen Božanić & Saurabh Sinha
Language: eng
Format: epub
Publisher: Springer International Publishing, Cham

5.3.3 Bond Wires

Bond wires are very thin metals used to connect the bonding pads of an IC to the pins (leads) of the IC package [10]. Typically, they are made of gold, copper, or aluminum. They normally present a parasitic quantity for signals transmitted between systems inside and outside the packaged device because of their inductive behavior [11]. The fact that the bond wire is inductive can be used as an advantage in RF and microwave design.

Electrical characteristics of bond wires depend on the type of material of which they are made, the wire cross-section (or radius), the horizontal length and the pitch between the adjacent wires, if more than one bond wire is used [12]. Inductance in henries of the bond wire is approximated as [13]:

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